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 STHDMI001A
3.3V, High Bandwith, 2-to-1 High Definition Multimedia Interface (HDMI) Switch with Single Enable
Features
Compatible with HDMI v1.1 and DVI v1.0 digital interfaces Data rate per channel for UXGA: 1.65Gbps 165MHz speed operation supports all video formats up to 1080p and SXGA (1280x1024 at 75 Hz) Low RON: 5.5 (typ) VCC operating range: 3.0V to 3.6V Low current consumption: 20A ESD Human Body Model HMB Voltage: - 4KV for HDMI connector inputs - 2KV for all other I/Os Channel ON Capacitance: 6pF (typ) Switching speed: 9ns Near-Zero Propagation Delay: 250ps Low crosstalk: -32dB at 825MHz Bit-to-Bit Skew: 200ps Very Low Ground Bounce in Flow Through Mode Data and control inputs provide an undershoot clamp diode Wide bandwidth minimizes skew and jitter Hot insertion capable Supports bi-directional operation Available in the TSSOP48 package -40C to 85C operating temperature range
TSSOP48


Description
The STHDMI001A is a differential Single Pole Double Throw (SPDT) 2-to-1, low RON, bidirectional HDMI switch. It is designed to support HDMI/DVI television systems that produce superior high-definition image quality. The differential signal from the 2 HDMI ports is multiplexed through the switch to form a single output HDMI channel going to the HDMI receiver, while the deselected output goes to the high-Z (high impedance) state. It is designed for very low cross-talk, low bit-to-bit skew, high channel-tochannel noise isolation, and low I/O capacitance. This switch offers very little high-speed signal attenuation at the outputs, thus preserving the signal integrity necessary to pass stringent interference requirements. STHDMI001A provides the ability to switch a single source output to various display devices or switch video display devices between multiple sources. It reduces the overall BOM costs by eliminating the need for more costly multi input output controllers


Applications

DVD Players Front projectors LCD TVs and Monitors Notebook PCs PDPs
Order Codes
Part Number STHDMI001A January 2006 Temperature Range -65C to +150C Package TSSOP48 Comments STHDMI001ATTR Rev.2 1/17
www.st.com 17
STHDMI001A
Contents
1 Summary Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 1.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Function Table STHDMI001A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 3
Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 DC and AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 3.2 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 6 7
ESD Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Mechanical Data (Body 48L Pitch 0.5mm) . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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STHDMI001A
1 Summary Description
1
1.1
Summary Description
Functional Description
The STHDMI001A routes physical layer signals for high bandwidth digital video and is compatible with low voltage differential signaling standards like Transition Minimized Differential Signaling (TMDS). The device multiplexes differential outputs from a video source to one of the two corresponding outputs, then to a common display. The low ON resistance (RON) and low I/O capacitance of the STHDMI001A result in a very small propagation delay. The device integrates SPDT-type switches for 3 differential data TMDS channels and 1 differential clock channel. Figure 1. Connections Diagram
3/17
1 Summary Description
STHDMI001A
Pin Description
Pin Name GND GND VCC GND Data0+ Data0- VCC GND Data1+ Data1- GND VCC Data2+ Data2- GND Clock+ Clock- GND SEL VCC GND NC GND VCC GND BClock- BClock+ AClock- AClock+ GND B2- B2+ A2- A2+ VCC GND B1- B1+ A1- A1+ GND B0- B0+ A0- A0+ GND VCC Type Power Power Power Power Output Output Power Power Output Output Power Power Output Output Power Output Output Power Input Power Power Power Power Power Input Input Input Input Power Input Input Input Input Power Power Input Input Input Input Power Input Input Input Input Power Power Function Ground Ground Supply Voltage (3.3V 10%) Ground TMDS Data0+ Output TMDS Data0-- Output Supply Voltage (3.3V 10%) Ground TMDS Data1+ Output TMDS Data1- Output Ground Supply Voltage (3.3V 10%) TMDS Data2+ Output TMDS Data2- Output Ground TMDS Clock+ Output TMDS Clock- Output Ground Selector Control input to select port A or port B Supply Voltage (3.3V 10%) Ground Not Connected Ground Supply Voltage (3.3V 10%) Ground TMDS Clock- for port B TMDS Clock+ for port B TMDS Clock- for port A TMDS Clock+ for port A Ground TMDS Data2- for port B TMDS Data2+ for port B TMDS Data2- for port A TMDS Data2+ for port A Supply Voltage (3.3V 10%) Ground TMDS Data1- for port B TMDS Data1+ for port B TMDS Data1- for port A TMDS Data1+ for port A Ground TMDS Data0- for port B TMDS Data0+ for port B TMDS Data0- for port A TMDS Data0+ for port A Ground Supply Voltage (3.3V 10%)
Table 1.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22, 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
Pin Number
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STHDMI001A
Figure 2. 2-to-1 HDMI Switch Functional Diagram
A0+ A0B0+ B0A1+ A1B1+ B1A2+ A2B2+ B2AClock+ AClockBClock+ BClockSEL Clock+ ClockData2+ Data2Data1+ Data1Data0+ Data0-
1 Summary Description
1.2
Function Table STHDMI001A
Table 2. STHDMI001A Functions
Selection L H Function TMDS Data and Clock for Port A TMDS Data and Clock for Port B
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2 Maximum Rating
STHDMI001A
2
Maximum Rating
Stressing the device above the rating listed in the "Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3.
Symbol VCC VS VIC IO TSTG TL VESD
Absolute Maximum Ratings
Parameter Supply Voltage to Ground DC Input Voltage DC Control Input Voltage DC Output Voltage Storage Temperature Lead Temperature (10sec) Electrostatic Discharge Voltage on HDMI Connector Pins 1 Value -0.5 to + 4.0 -0.5 to + 4.0 -0.5 to + 4.0 120 -65 to 150 300 150 Unit V V V mA C C mJ
Note:
Absolute maximum ratings are those values above which damage to the device may occur. Functional operation under these conditions is not implied. All voltages are referenced to GND. In accordance with the IEC61000-4-2, Level 4 standards. Table 4.
Symbol RthJA
Thermal data
Description Thermal Resistance Junction-ambient Value 59 Unit C/W
6/17
STHDMI001A
3 DC and AC Parameters
3
DC and AC Parameters
Table 5.
Symbol VIH VIL VIK IIH IIL
Electrical Characteristics
Parameter HIGH Level Input Voltage LOW Level Input Voltage Clamp Diode Voltage Input High Current Input Low Current Test Conditions1 High Level Guaranteed Low Level Guaranteed VCC = 3.6V, IIN = -18mA VCC = 3.6V, IIN = VCC VCC = 3.6V, IIN = GND VCC = 0V; Data0+, Data0-, Data1+, Data1-, Data2+, Data2-, Clock+, Clock- = 0V; A0+ to AClock- and B0+ to BClock- = 3.6V VCC = 3.0V, VIN = 1.5 to V CC IIN = -40mA VCC = 3.0V, VIN = 1.5 to V CC IIN = -40mA VCC = 3.0V, VIN = 1.5 to V CC IIN = -40mA 0.5 1 0.8 5.5 Min. 2.0 -0.5 -0.8 0.8 -1.2 5 5 5 Typ. Max. Unit V V V A A A
IOFF
Power Down Leakage Current
RON RFLAT
Switch ON resistance (Note 2) ON resistance flatness (Note 2,3) ON resistance match between channels
7.5
RON
RON = RONMAX - RONMIN
(Note 3,4)
Note: 1 Valid for Ambient Operating Temperature: TA = -40 to 85C; VCC = 3.3V 10% (except where noted). 2 Measured by voltage drop between channels at the indicated current through the switch. Onresistance is determined by the lower of the two voltages. 3 Flatness is defined as the difference between the RONMAX and the RONMIN of the on resistance over the specified range. 4
RON measured at the same VCC, temperature and voltage level.
7/17
3 DC and AC Parameters
STHDMI001A
3.1
Capacitance
Table 6.
Symbol CIN COFF CON
Capacitance
Parameter Input Capacitance (Note:4) Port x0 to Port x1, Switch Off (Note:4) Test Conditions VIN = 0V VIN = 0V Min. Typ. 2 4 7.5 Max. 3 6 11 Unit pF pF pF
Capacitance Switch on (x to x0 or x to x1) VIN = 0V (Note:4)
Note:
4. x = Data0+, Data0-, Data1+, Data1-, Data2+, Data2-, Clock+, Clock- X0 = A0+, A0-, A1+, A1-, A2+, A2-, AClock+, AClock- X1 = B0+, B0-, B1+, B1-, B2+, B2-, BClock+, BClock-
3.2
Power Supply
Table 7.
Symbol ICC
Power Supply Characterics
Parameter Quiescent Power Supply Current Test Conditions VCC = 3.6 V, VIN = VCC or GND Min. Typ. Max. Unit
150
500
A
Note:
Valid for Ambient Operating Temperature: TA = -40 to 85C; VCC = 3.3V 10% (except where noted).
8/17
STHDMI001A
4 Dynamic Characteristics
4
Dynamic Characteristics
Figure 3. Measurement Circuit
CL = Load Capacitance: includes jig and probe capacitance. RT = Termination Resistance: should be equal to ZOUT of the Pulse Generator. Table 8.
Symbol
Dynamic Characteristics
Parameter Non-adjacent channel Cross-talk Test conditions RL = 100, f = 250MHz RL = 100, f = 370MHz RL = 100, f = 825MHz Off Isolation RL = 100, f = 250MHz RL = 100, f = 370MHz RL = 100, f = 500MHz RL = 100, f = 825MHz Data rate per channel Min. Typ. -45 -42 -32 -40 -36 -30 -25 1.65 Max. Unit dB dB dB dB dB dB dB Gbps
XTALK
OIRR
DR
Note:
Valid for Ambient Operating Temperature: TA = -40 to 85C; VCC = 3.3V 10% (except where noted).
9/17
4 Dynamic Characteristics
STHDMI001A
Table 9.
Symbol
Dynamic Switching Characteristics
Parameter Test conditions VCC = 3V to 3.6V VCC = 3V to 3.6V VCC = 3V to 3.6V VCC = 3V to 3.6V VCC = 3V to 3.6V 0.5 0.5 Min. Typ. 0.25 6.5 6.5 0.1 0.1 9 8.5 0.2 0.2 Max. Unit ns ns ns ns ns
tPLH, tPHL Propagation Delay tPZH, tPZL Line Enable Time, SEL to x to x0 or x to x1, Note:4 tPHZ, tPLZ Line Disable Time, SEL to x to x0 or x to x1, Note:4 tSK(0) Output skew between center port to any other port tSK(P) Skew between opposite transition of the same output (tPHL - tPLH) tON tOFF Propagation Delay Propagation Delay
VCC = 3V to 3.6V VCC = 3V to 3.6V
50 30
ns ns
Note:
4. x = Data0+, Data0-, Data1+, Data1-, Data2+, Data2-, Clock+, Clock-. X0 = A0+, A0-, A1+, A1-, A2+, A2-, AClock+, AClock- X1 = B0+, B0-, B1+, B1-, B2+, B2-, BClock+, BClock-
Note:
Valid for Ambient Operating Temperature: TA = -40 to 85C; VCC = 3.3V 10% (except where noted).
4.1
Timing Characteristics
Figure 4.
SEL 1.25V 1.25V 0V t PZL Output VO H V CC /2 V OL + 0.3 V OL t PLZ
Enable and Disable Timings
2.5V
t PZH
t PH Z V OH - 0.3 V CC /2 VO H
Output
V OL
10/17
STHDMI001A
Figure 5. Output Skew
4 Dynamic Characteristics
3.5V
2.5V
Data In 1.5V tPLHX tPHLX
VOH
2.5V 2.5V
Data Out at Port A VOL tSK (o) VOH
2.5V
Data Out at Port B VOL tPLHY tSK (o) = | tPLHy - tPLHx | or | tPHLy - tPHLx tPHLY |
Figure 6.
Propagation Delay Timings
3V .5
2V .5
2V .5
I pt nu
15 .V tP H L 2V .5 tH PL
VH O 25 .V
Otp t uu
VL O
11/17
4 Dynamic Characteristics
STHDMI001A
Figure 7.
Pulse Skew
3V .5
2V .5
In u pt 1V .5 tP H L tP L H
VH O
25 .V
O tp t uu VL O tS ( ) =| tP L -tP H | Kp H L
12/17
STHDMI001A
5 ESD Performance
5
ESD Performance
Table 10.
Symbol ESD
ESD Performance
Parameter Test conditions Air Discharge (10 pulses) Contact Discharge (10 pulses) Air Discharge (10 pulses) Contact Discharge (10 pulses) Min. Typ. 4 4 Max. Unit kV kV
IEC-61000-4-2 (A0+ to A2+, A0- to A2-, AClock+, AClock-, B0+ to B2+, B0- to B2-, BClock+, BClock-) IEC-61000-4-2 (other pins)
2 2
kV kV
13/17
6 Mechanical Data (Body 48L Pitch 0.5mm)
STHDMI001A
6
Mechanical Data (Body 48L Pitch 0.5mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
14/17
STHDMI001A
6 Mechanical Data (Body 48L Pitch 0.5mm)
TSSOP48 MECHANICAL DATA
mm MIN. A A1 A2 b c D E E1 e K L 0o 0.50 0.05 0.85 0.17 0.09 12.4 7.95 6.0 12.5 8.1 6.1 0.5 BSC 4o 0.60 8o 0.70 0o 0.020 0.10 0.9 TYP. MAX. 1.1 0.15 0.95 0.27 0.20 12.6 8.25 6.2 0.002 0.335 0.0067 0.0035 0.408 0.313 0.236 0.492 0.319 0.240 0.0197 BSC 4o 0.024 8o 0.028 0.004 0.354 MIN. inch TYP. MAX. 0.433 0.006 0.374 0.011 0.0079 0.496 0.325 0.244
DIM.
A
A2 A1 b e K c L E
D
E1
PIN 1 IDENTIFICATION
1
15/17
7 Revision History
STHDMI001A
7
Revision History
Date 09-Sep-2005 03-Jan-2006 Revision 1 2 First issue Added the maximum data rate support. Added crosstalk, off-isolation values at higher frequencies. Description of Change
16/17
STHDMI001A
7 Revision History
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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